Features & Benefits
- Microprocessor-controlled for precise automation.
- Soldering area of 180 x 235 mm for versatile use.
- Temperature range from 0℃ to 280℃ for various applications.
- Fast and accurate heating using infrared radiation.
- Supports single and double PCB panels with all encapsulation forms.
- User-friendly interface with LCD display and pre-set heating modes.